Title: Quality Assessments of Solder Bump Interconnections in Ball Grid Array Packages Using Laser Ultrasonics and Laser Interferometer When: Friday, March 1, 2013 at 2:00 PM Where: MARC Building, Room 431
Event Subject
Quality Assessments of Solder Bump Interconnections in Ball Grid Array Packages Using Laser Ultrasonics and Laser Interferometer
Event Speaker
Jie Gong
Event Location
MARC Building, Room 431
Event Date