Title: Cohesive Zone Modeling for Predicting Interfacial Delamination in Microelectronic Packaging When: Monday, March 31, 2014 at 10:00 AM Where: MARC Building, Room 431
Event Subject
Cohesive Zone Modeling for Predicting Interfacial Delamination in Microelectronic Packaging
Event Speaker
William Krieger
Event Location
MARC Building, Room 431
Event Date