Title: Thermal Management of 3-D Stacked Chips Using Thermoelectric Coolers and Microfluidic Devices When: Wednesday, June 19, 2013 at 10:00 AM Where: Love Building, Room 109
Event Subject
Thermal Management of 3-D Stacked Chips Using Thermoelectric Coolers and Microfluidic Devices
Event Speaker
Matthew Redmond
Event Location
Love Building, Room 109
Event Date