Title: On-chip dielectric cohesive fracture characterization and mitigation investigation through off-chip carbon nanotube interconnects When: Wednesday, December 12, 2012 at 1:30 PM Where: MARC Building, Room 201
Title: Experimental and Theoretical Assessment of Through-Silicon Vias for 3D Integrated Microelectronic Packages When: Friday, December 14, 2012 at 2:00 PM Where: MARC Building, Room 201
Title: Electroplated Multi-Path Compliant Copper Interconnects for Flip-Chip Packages When: Monday, December 17, 2012 at 1:00 PM Where: MARC Building, Room 401
Title: Nonlinear Ultrasound for Radiation Damage Detection in Nuclear Reactor Steel When: Wednesday, January 16, 2013 at 1:00 PM Where: Love Building, Room 210
Title: Characterization of Lymphatic Pump Function in Response to Mechanical Loading When: Wednesday, January 30, 2013 at 3:00 PM Where: IBB Building, Room 1128
Title: PhD Proposal Presentation When: Wednesday, April 17, 2024 at 11:00 AM Where: MARC Building, Room 201
Title: Microstructure-Sensitive Modeling of the Shock Response of FCC Metals When: Tuesday, February 19, 2013 at 3:00 PM Where: Love Building, Room 210
Title: Computational and Experimental Multi-scale Transient Thermal Characterization of Microelectronics When: Friday, February 22, 2013 at 2:00 PM Where: Boggs Building, Room 3-47
Title: Crystal Plasticity Computations Using Spectral Databases When: Monday, February 25, 2013 at 3:00 PM Where: Love Building, Room 109
Title: Quality Assessments of Solder Bump Interconnections in Ball Grid Array Packages Using Laser Ultrasonics and Laser Interferometer When: Friday, March 1, 2013 at 2:00 PM Where: MARC Building, Room 431