Education

  • Ph.D., Institut d'Electronique du Sud, Universite Montpellier 2, ENS Cachan, France 2010
  • M.S., Universite Paris Saclay, ENS Cachan, 2007
  • B.S., Universite Paris Saclay, ENS Cachan, 2004

Teaching Interests

Professor Smet's teaching interests encompass core mechanical engineering courses at both undergraduate and graduate levels, with emphasis on materials science, engineering mechanics, and thermal-fluid sciences, with core applications in electronic packaging and semiconductor science. She prioritizes cultivating interdisciplinary analytical skills and practical understanding in students through rigorous coursework, experiential learning through lab components, and application-driven projects. Her instruction integrates fundamental principles with contemporary engineering challenges to prepare students for research and professional practice in mechanical engineering disciplines in the semiconductor industry.

Research Interests

Professor Smet's research centers on advancing materials and processes for the next generation of electronic systems with advanced performance and reliability. Through exploration of microstructure-property-process relationships, her work aims at the development of novel materials with unique combinations of properties within the manufacturing constraints of the semiconductor industry. Her work involves experimental characterization and computational modeling to understand and manipulate material behavior under various mechanical, electrical, and thermal conditions from unit-level processing to system integration. Integration of machine-learning and AI techniques further allows for property prediction and comprehensive multi-physics optimization in advanced package architectures. The research aims to contribute to innovations in materials design and processing, fostering interdisciplinary collaboration between material science, electrical, and mechanical engineering.

Recent Publications

  • O E. Torres Surillo, C. Molina-Mangual, H. Park, R. Sosa, V. Smet, “Bayesian Optimization of Large, Glass BGA Package Design for System-Level Reliability in Chiplet-Based High-Performance Computing and AI Architectures”, 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Denver, CO.
  • O C. Molina-Mangual, E. Torres Surillo, N. Nedumthakady, V. Smet, “Mitigating Cracking from TGV and RDL Stress in Glass Substrates with Low-CTE Electrodeposited Copper-Graphene Composites”, 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Denver, CO.
  • O R. Sosa, E. Torres Surillo, C. Molina-Mangual, V. Smet, “A Study of Chip-Package Interaction with All-Copper Interconnections on Advanced Glass Substrates”, 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Denver, CO.
  • O N. Shahane, K. Mohan, A. Antoniou, V. Smet, “Anomalous evolution of topology in nanoporous copper under thermal and electrolyte treatment”, Materialia, vol. 28, p. 101757, 2023. 
  • O M. Muslu, V. Smet, Y. Joshi, “Compact SiC Power Module with Integrated Power Delivery and Cooling”, IEEE Transactions on Components, Packaging and Manufacturing Technology 12(12), 2022.