ME 7228: Thermo-Mechanical Reliability in Electronic Packaging-Modeling and Validation
Offered Spring, Odd Years
|Prerequisites:||ME 6124 (Finite-Element Method: Theory and Practice) and ME 6222 (Manufacturing Processes and Systems)|
|Catalog Description:||Modeling and validations of thermomechanical behavior of printed wiring board and PWB Assembly, including: microelectronic packaging, packaging materials, manufacturing process modeling, reliability, failure modes.|
|Textbooks:||John H. Lau, Thermal Stress and Strain in Microelectronic Packaging, Van Nostrand Reinhold, 1993|
|Instructors:||Suresh Sitaraman (ME) and Charles Ume (ME)|
R. Tummala and E. Rymaszewski, Microelectronics Packaging Handbook, Van Nostrand Reinhold, 1996
Michael G. Pecht, Luu T. Nguyen, Edward B. Hakim, Plastic-Encapsulated Microelectronics : Materials, Processes, Quality, Reliability, and Applications, Wiley, 1995
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|Proposed Course Outline||
|Full justification of request||
Dramatic changes are underway in the computer, telecommunication, automotive, and consumer electronics industries. The common and pervasive requirements of these electronics industries are: (1) ultra-low cost, (2) thin, light, and portable, (3) high performance, and (4) diverse functions. With continued increase in performance and with continued miniaturization of components, thermo-mechanical reliability of electronic packages is a key concern in the Microelectronics Industry. To address thermo-mechanical reliability, scientists/engineers should have a broad exposure to electronic materials and their properties, manufacturing and operating conditions, failure modes, and several modeling and experimental techniques.
The presence of the Packaging Research Center, Manufacturing Research Center, and Microelectronics Research Center have stimulated significant research interest among graduate students in various aspects of electronic packaging. However, there is no comprehensive course offered today that addresses the needs of those students who wish to pursue research/career in the area of Thermo-Mechanical Reliability of Electronic Packages.
The proposed graduate-level course entitled "Thermo-Mechanical Reliability in Electronic Packaging - Modeling and Validation" will address this deficiency. As shown in the outline, this course will expose students to various qualification techniques in electronic packaging, failure modes in electronic packaging, thermo-mechanical modeling, and experimental techniques to assess reliability.