ME 7228: Thermo-Mechanical Reliability in Electronic Packaging-Modeling and Validation

Offered Spring, Odd Years


Credit Hours: 3-0-3
Prerequisites: ME 6124 (Finite-Element Method: Theory and Practice) and ME 6222 (Manufacturing Processes and Systems)
Catalog Description: Modeling and validations of thermomechanical behavior of printed wiring board and PWB Assembly, including: microelectronic packaging, packaging materials, manufacturing process modeling, reliability, failure modes.
Textbooks: John H. Lau, Thermal Stress and Strain in Microelectronic Packaging, Van Nostrand Reinhold, 1993
Instructors: Suresh Sitaraman (ME) and Charles Ume (ME)
References:

R. Tummala and E. Rymaszewski, Microelectronics Packaging Handbook, Van Nostrand Reinhold, 1996

Michael G. Pecht, Luu T. Nguyen, Edward B. Hakim, Plastic-Encapsulated Microelectronics : Materials, Processes, Quality, Reliability, and Applications, Wiley, 1995

Goals:

  • To provide an in-depth understanding of the thermo-mechanical modeling and validation aspects of microelectronic packages;
  • to expose students to various qualification techniques in electronic packaging, failure modes in electronic packaging, electronic packaging materials, and process modeling techniques;
  • to provide hands-on exposure to experimental techniques in packaging reliability.
Topics:
  • Introduction to Microelectronic Packaging
    • Packaging Hierarchy
    • Types of Packaging - Insertion, SMT, DCA
  • Packaging Materials
    • Substrate
    • Interconnect
    • Encapsulants
    • Molding Compounds
    • Passivation
  • Reliability Issues associated with Service Conditions
    • Automotive
    • Aerospace
    • Telecommunications
    • Computer
    • Consumer
    • Military
  • Manufacturing Processes and Reliability Issues
    • Substrate Fabrication Process
    • Solder Reflow Process
  • Qualification Techniques
    • Qualification Process
    • Accelerated Testing
    • Thermal Cycling, Shock, Steady-State
    • Humidity test
  • Failure Modes
    • Warpage
    • Delamination
    • Fatigue Crack Propagation
    • Brittle Fracture, Ductile Fracture
  • Thermo-Mechanical Modeling
    • Material and Geometry Modeling
    • Substrate
    • Package - SMT, Insertion, DCA
  • Experimental Validation Approaches
    • SAM
    • X-Ray
    • Laser
    • Electron Microscopy
    • Moir Interferometer
    • Ultrasound
  • Industrial Interactions
    • As part of industrial interaction, at least two visits to local electronic industry will be arranged. Alternatively, at least two thermo-mechanical reliability and validation experts from industry will be invited to give guest lectures.
Delivery mode (%):

Lecture

80

Discussion

20

Grading scheme (%):

Homework

20

Project

30

Midterm

25

Final Exam

25

Proposed Course Outline

Topic

Instructor

Introduction to Microeelctronic Packaging

Sitaraman

Packaging Materials

Sitaraman

Reliability Issues Associated with Service Conditions

Sitaraman

Manufacturing Processes and Reliability Issues

Ume

Qualification Techniques

Ume

Failure Modes

Ume

Midterm Examination

Ume/Sitaraman

Thermo-Mechanical Modeling

Sitaraman

Experimental Validation Approaches

Ume

Final Examination

Sitaraman/Ume

Full justification of request

Dramatic changes are underway in the computer, telecommunication, automotive, and consumer electronics industries. The common and pervasive requirements of these electronics industries are: (1) ultra-low cost, (2) thin, light, and portable, (3) high performance, and (4) diverse functions. With continued increase in performance and with continued miniaturization of components, thermo-mechanical reliability of electronic packages is a key concern in the Microelectronics Industry. To address thermo-mechanical reliability, scientists/engineers should have a broad exposure to electronic materials and their properties, manufacturing and operating conditions, failure modes, and several modeling and experimental techniques.

The presence of the Packaging Research Center, Manufacturing Research Center, and Microelectronics Research Center have stimulated significant research interest among graduate students in various aspects of electronic packaging. However, there is no comprehensive course offered today that addresses the needs of those students who wish to pursue research/career in the area of Thermo-Mechanical Reliability of Electronic Packages.

The proposed graduate-level course entitled "Thermo-Mechanical Reliability in Electronic Packaging - Modeling and Validation" will address this deficiency. As shown in the outline, this course will expose students to various qualification techniques in electronic packaging, failure modes in electronic packaging, thermo-mechanical modeling, and experimental techniques to assess reliability.